TSMC will build a fab in Europe for 28/22nm and 16/12nm chips

Several key partners just announced plans to build the European Semiconductor Manufacturing Company (ESMC) GmbH – a joined venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors. TSMC will hold a 70% stake, the other three will have 10% each. ESMC will begin construction of a fab in the second half of next year and plans to begin mass production of chips in 2027. Before you get too excited, note that this fab will focus on older nodes. The target is to produce 40,000 300mm (12”) wafers per month using TSMC’s 28/22nm planar CMOS process and the 16/12nm FinFET...
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